Teradyne’s Post

What’s Missing In Test? It varies between groups, departments and companies. But one thing is for sure, Test is getting more critical and complex. If you are not thinking about it early in your development process - architecture and design phases - are you already losing quality? Check out the continuation of our round table discussion. Please share your thoughts and experiences in the comments!

What's missing in test? Read Semiconductor Engineering's "Experts at the Table" interview with Advantest Europe's V9300 platform extension manager Klaus-Dieter Hilliges and other experts as they discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing. https://lnkd.in/gWb_BTBi #SemiconductorEngineering #SemiconductorIndustry #SemiconductorTest

🌟 Understanding the Challenges in Pre-Silicon and Post-Silicon Validation Let's talk about a crucial phase in semiconductor manufacturing: validation before and after silicon fabrication. 🧐 Here are some key challenges faced during these stages: Pre-Silicon Validation: Before a chip goes into production: Getting it Right from the Start: Ensuring the design is accurate and meets all specs upfront is crucial. Mistakes here can lead to costly rework later. Handling Complexity: Modern designs are super complex. We need to simulate everything from functionality to timing and power use, which takes a lot of time and resources. Integration Testing: Making sure all the different parts of the chip work together smoothly is tough as designs get bigger and more intricate. Post-Silicon Validation: After the chip comes back from fabrication: Finding Bugs in Real Hardware: Identifying and fixing issues that only show up in the physical silicon can be tricky. It requires specialized tools and a lot of patience. Covering All Bases: Testing everything thoroughly to catch both functional and non-functional issues can be a real challenge. Time and Money: It's costly and time-consuming to validate silicon after fabrication. Delays can hurt a product's launch and competitiveness. Meeting Standards: Making sure the chip meets all industry standards and regulatory requirements adds another layer of complexity. Navigating these challenges takes teamwork, advanced planning, and using the best tools available. It's a crucial part of bringing cutting-edge technology to life! #Semiconductor #Validation #EngineeringChallenges #TechIndustry

ROUNTABLE ALERT: Ann Mutschler at Semiconductor Engineering led a roundtable with six industry experts to explore the tradeoffs of power and performance when handling voltage droop. Venkatesh Santhanagopalan (Movellus Inc.), Joseph C. Davis (Siemens EDA (Siemens Digital Industries Software)), Rajat Chaudhry (Cadence Design Systems), Bill Mullen (Ansys), Heidi Barnes (Keysight Technologies), and Karthik Srinivasan (Synopsys Inc) dive deep on how higher current densities set against lower power envelopes makes meeting specs more challenging, especially at advanced nodes. https://lnkd.in/gCrUbZCN

Chiplet-based design incurs challenges around packaging, power delivery, verification, testability, & much more. Together with Alchip Technologies, Synopsys is addressing these issues to deliver the ROI & physical benefits of a multi-die design.

Is your silicon bring-up process effective enough to detect defects, and ensure that the semiconductor device operates according to its design specifications? During the silicon bring-up process, newly manufactured silicon chips are tested for the first time to verify their functionality. This phase is crucial but often causes unexpected delays because identifying and diagnosing complex defects requires sophisticated testing and analysis methods. But what if you had a partner with years of expertise in Silicon Bring-Up and Characterization to guide you through this process? At SilTest we’re experts in Silicon Debug, Device Characterisation, and Yield Enhancement. We focus on optimising throughput and reducing test time to accelerate your project's pace and improve the overall yield. Through working with failure analysis, we ensure that we pinpoint and address the root causes effectively. For every semiconductor or packaged device, we help you streamline your path from lab to fab, ensuring your project meets its deadlines and quality standards. How could our expertise in streamlining the path from lab to fab impact your next project's success? Let's explore the possibilities together! 🤝🏼 #semiconductorindustry #siliconbringup #semiconductormanufacturing

Co-optimization strategies must begin on day one of next-generation technology development to produce reliable chips with acceptable yield. Read more via Semiconductor Engineering, where Teradyne’s Nitza Basoco shares insights on how DTCO/STCO are creating a path for faster yield ramps: https://bit.ly/43rKYbG

Speed Up Your Time-to-Market: Unveiling the Secrets of Efficient Post-Silicon Validation The semiconductor industry is a race against the clock. While meticulous design is crucial, getting products to market quickly is essential for success. Here's where post-silicon validation comes in. This critical testing phase ensures flawless functionality and exceptional performance of your chips. But how can you optimize this process to accelerate time-to-market? Our latest blog post dives deep into strategies for efficient post-silicon validation, exploring: ⏳The two key phases: Test engineering and product engineering. ⏳ Actionable strategies to expedite each phase, including: Prescient test development In-depth debugging Reusable test IP libraries Yield analysis Throughput enhancement Smart test coverage decisions ⏳The impact of efficient validation on your competitive edge. Ready to unlock the secrets of faster time-to-market? Read the full blog post here: https://lnkd.in/ekYjJqXy #semiconductor #technology #innovation #engineering #validation #timetomarket #newblogpost Suresh Babu Dinesh Prasanna CS Chang Maheswari Veeravenu Senthilkumar Dhamodharan Senthil Kumar Vaishnavi Saravanan Nachiappan G Gowrisankar Arumugasamy Aishwarya S RAJESHWARI G.

Our CEO, Dick Otte, recently participated in Semiconductor Engineering’s “Experts at the Table” panel session exploring current problems and potential solutions in heterogeneous integration (HI). Read the article below for insights and varying perspectives from some of the industry’s key players within the HI ecosystem. https://lnkd.in/gswdnbVg #QPTechnologies #HeterogeneousIntegration #Semiconductors #HI

Looking to optimize device performance in semiconductor fabrication without direct wafer testing? Learn how virtual fabrication can guide process and integration teams in developing process recipes for memory and logic devices on Lam Research's blog. #LifeAtLam