SK hynix reports record Q1 with soaring demand for #HBM #chips #SKhynix saw first 2024 quarter revenues soar 144 percent as demand for high-bandwidth memory (HBM) chips rocketed. The #DRAM and #NAND manufacturer reported ₩12.43 trillion ($9.03 billion) in revenues with a ₩1.92 trillion ($1.4 billion) profit compared to last year’s ₩2.6 trillion ($1.9 billion) loss. This was a record first quarter revenue amount. DRAM accounted for 61 percent of its revenue and NAND 35 percent, with the remainder coming from other activities. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejUBVCMT #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #ai #artificialintelligence #semiconductormanufacturing #chips
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𝐀𝐧 𝐈𝐧-𝐃𝐞𝐩𝐭𝐡 𝐄𝐱𝐩𝐥𝐚𝐧𝐚𝐭𝐢𝐨𝐧 𝐨𝐟 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐲: 𝐂𝐨𝐖𝐨𝐒 Source: By TrendForce Corporation (https://lnkd.in/ggRsYwk4) Over the past few decades, #semiconductormanufacturing #technology has evolved from the #10,000nm process in #1971 to the #3nm process in #2022, driven by the need to increase the number of #transistors on #chips for enhanced #computational performance. However, as applications like #artificialintelligence (#AI) and #AIGC rapidly #advance, demand for higher core chip #performance at the device level is growing. While #process #technology #improvements may encounter #bottlenecks, the need for #computing #resources continues to rise. This underscores the importance of #advanced #packaging #techniques to boost the number of #transistors on #chips.
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How Am I Involved in the Democratisation of AI with Microchip USA? 🤖✨ I worked in AI and saw the technical constraints companies like NVIDIA, AMD, and Intel Corporation are now trying to overcome. Their products can be unavailable through their stock because of huge demand, and companies need to source them from what we call the open market. 🌐🏪 We at Microchip USA support a lot of data center racks and blade manufacturers with high-end electronic components. These companies are working with us for several reasons: 🔥 Better pricing ⏱️ Shorter lead-time 📦 Extended supply availability Contact me to learn more if we can support you in sourcing high-end electronic components! 📩 #AI #FPGAs #ElectronicsManufacturing
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Our Semiconductor 1H 2024 Forecast Report is now available! In our 1H2024 Semiconductor Industry Forecast Report, we do a thorough analysis of both macro and micro elements shaping the semiconductor market and thus arrive at a comprehensive 7-year forecast projection. This report is EUV centric, as the semiconductor market is riding the AI boom which is being enabled by the EUV machines with High NA (latest version). Hence, it does an extensive coverage of leading-edge foundries, leading edge logic and DRAM manufacturers. A valuable takeaway is how AI supply chain is requiring significant customization of the Logic, Memory, and Packaging solutions. We have also included a Novel AI architecture snapshot extract to throw light on the need for customization. Q1 2024 Key Updates 1.Shipment of High NA EUV tools 2.the AI supply chain ramp up around Nvidia but also new AI suppliers 3.the recovery of the smartphone and partially of the computing markets Years of multiple validation ensures that one can rely on our forecast for informed decision-making. Our forecast report can be easily tailored to meet the specific requirements of potential customers. To maintain our forecast, we do a quarterly market analysis of the supply chain and the end market to guarantee that our data stays up to date. Looking Ahead We're diligently working on extending our forecast to include the backend, with a special focus on China OSATs. #AI #SupplyChain#EUV #WaferFab #Semiconductor Forecast #TechnologyTrends Let us know in the comments if you have any questions about our forecast or the semiconductor industry! Alternatively, you can direct your enquiries to ebouche@svrigroup.com
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Global Semiconductor Fab Capacity projected to expand 6% in 2024 and 7% in 2025, SEMI reports 🤩💡 To keep pace with unremitting growth in demand for #chips, the global #semiconductormanufacturing industry is expected to increase capacity by 6% in 2024 and post a 7% gain in 2025, reaching a record capacity high of 33.7 million #wafers per month (wpm: 8-inch equivalent), SEMI announced in its latest quarterly World Fab Forecast report. Leading-edge capacity for #5nm nodes and under is expected to grow 13% in 2024, chiefly driven by generative #artificialintelligence (#AI) for #datacenter training, inference, and leading-edge devices. To increase processing power efficiency, #chipmakers including Intel Corporation, Samsung Electronics, and TSMC are poised to start production of #2nm Gate-All-Around (#GAA) #chips, boosting total leading-edge capacity growth by 17% in 2025. Thanks again SEMI for the full article with more background and insights https://lnkd.in/eN_ZKshC #semiconductorindustry #semiconductors #semiconductor #tech #it #ic #chip #chips #semiconductormanufacturing #innovation #geopolitics #ai
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TSMC REPORTEDLY SECURES ANOTHER AI OPPORTUNITY, WINNING ORDER FROM SK hynix According to the Economic Daily News, TSMC has secured a new AI business opportunity. Partnering with Global Unichip Corporation (GUC), TSMC is making strides in producing high-bandwidth memory (HBM) components for AI servers. They have secured a significant order for next-gen HBM4 base die chips. Despite TSMC and GUC’s typical discretion on order details, SK Hynix has clarified no contract with GUC for next-gen AI memory chips. However, industry sources note robust AI demand driving HPC and HBM needs, creating opportunities for major memory manufacturers like SK Hynix, Samsung Electronics, and Micron Technology. As AI chip production advances to 3nm next year, current HBM3 and HBM3e capacities are strained. Thus, memory manufacturers are ramping up investments in HBM4, aiming for mass production by late 2025. The JEDEC Solid State Technology Association is also setting new HBM4 standards, hinting at relaxed stacking height limits. This suggests advanced packaging technology might be deferred. SK Hynix is collaborating with TSMC to advance HBM4. GUC has secured the critical design order for SK Hynix’s HBM4 base die, with production potentially starting next year using TSMC’s 12nm and 5nm processes. Thanks again to TrendForce Corporation for the full article with more background and insights click the source link in the comments below 💡 🙏👇 Visit International Semiconductor Executive Summits #Semiconductor #AI #TSMC #HBM4 #Innovation #TechNews
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Check out these great insights from our IC & Semiconductor Specialist, Emir Bastug, on his involvement in the democratization of AI!
How Am I Involved in the Democratisation of AI with Microchip USA? 🤖✨ I worked in AI and saw the technical constraints companies like NVIDIA, AMD, and Intel Corporation are now trying to overcome. Their products can be unavailable through their stock because of huge demand, and companies need to source them from what we call the open market. 🌐🏪 We at Microchip USA support a lot of data center racks and blade manufacturers with high-end electronic components. These companies are working with us for several reasons: 🔥 Better pricing ⏱️ Shorter lead-time 📦 Extended supply availability Contact me to learn more if we can support you in sourcing high-end electronic components! 📩 #AI #FPGAs #ElectronicsManufacturing
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📢📢📢 Honeng Daily news for Semicondutors (2024.03.05) Memory IC facing price up and MFG production reduction will be end ! 🔹 With the explosive increase in demand for HBM and DDR5 driven by AI, Memory MFG reduction in production is coming to end. 🔹The market prices will continue to rise in March for Memory IC; AI applications will be extended in various fields, with the highest growth rate in the server sector. 🔹The demand for PCs and mobile phones had improved from 2023.Q4. In addition, the rise of AI will drive terminal products equipped with AI, and downstream demand will gradually increase, It is expected that the three major suppliers will end to reduce production until the middle of 2024!
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#MondayMusings: We are so used to chips and semiconductors that we fail to comprehend how incredibly sophisticated and tiny they are. Perhaps the single most complex thing that humanity has ever invented. Here is a mindboggling fact: A human red blood cell is around 7,000 nanometers wide, and TSMC is now developing 1.4-nanometer chips! #SemiConductors #Chips
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Rising AI Chip Demand Fuels TSMC's First-Quarter Growth #TSMC #AIChips #TechIndustry #InnovationLeaders #Semiconductor #EarningsReport Taiwan Semiconductor Manufacturing Co., the primary producer of advanced chips employed in artificial intelligence applications, is anticipated to reveal a 5% uptick in first-quarter profits on Thursday, buoyed by strong demand. Being the largest contract chipmaker globally, TSMC counts among its clients industry giants like Apple and Nvidia, benefitting from the escalating adoption of AI. This momentum has shielded the company from the downturn in electronics demand post-pandemic and has propelled its stock to unprecedented levels.
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🔥 The microchip landscape is evolving rapidly, and we're at the forefront of this transformation! With the global 2nm wafer revolution, we're not just keeping pace; we're setting the speed for 2024! 🚀 🔹 Unprecedented efficiency 🔹 Stellar performance enhancements 🔹 Eco-friendly advancements The journey to smaller, more powerful chips is on a fast track. Are you ready to ride the wave of innovation with us? Share your thoughts on how this leap in technology will shape our digital future! 💡 🔗Read the full article: https://lnkd.in/ev7KemVT #Technology #Innovation #Microchips #Semiconductors #2nmTechnology #TechTrends #DigitalTransformation #SustainableTech #FutureIsNow #TechCommunity
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Sales Director @ ATL Electronics | New Business Development, Analog Semiconductors, Wireless Technolog. Help HW/SW Engineers over their New Designs.
3moAdditional comments about SK hynix: Investments in AI Memory Technologies: SK Hynix is investing heavily in AI memory chips The company has committed $1 billion to expand its AI memory chip technology, particularly in high-bandwidth memory that is essential for AI applications. Expanding Facilities and Capabilities: In 2024, SK Hynix is ramping up its semiconductor packaging capabilities to meet the growing demand for high-performance computing and AI applications. They are also planning to establish a new semiconductor packaging facility in West Lafayette, Indiana, with an investment of $3.87 billion, which will focus on advanced chip packaging technologies. Strategic Focus on High-Performance DRAM: For 2024, SK Hynix has highlighted plans to continue focusing on high-performance DRAM products such as HBM3E and HBM4, responding to the rising demand for AI memory. They are aiming to strengthen their technological leadership by developing high-capacity server and mobile modules.