Marco Mezger’s Post

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Industrial / Specialty Memory, Storage & Semiconductor Expert

SK hynix reports record Q1 with soaring demand for #HBM #chips #SKhynix saw first 2024 quarter revenues soar 144 percent as demand for high-bandwidth memory (HBM) chips rocketed. The #DRAM and #NAND manufacturer reported ₩12.43 trillion ($9.03 billion) in revenues with a ₩1.92 trillion ($1.4 billion) profit compared to last year’s ₩2.6 trillion ($1.9 billion) loss. This was a record first quarter revenue amount. DRAM accounted for 61 percent of its revenue and NAND 35 percent, with the remainder coming from other activities. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejUBVCMT #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #ai #artificialintelligence #semiconductormanufacturing #chips

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Carlos Unda

Sales Director @ ATL Electronics | New Business Development, Analog Semiconductors, Wireless Technolog. Help HW/SW Engineers over their New Designs.

3mo

Additional comments about SK hynix: Investments in AI Memory Technologies: SK Hynix is investing heavily in AI memory chips The company has committed $1 billion to expand its AI memory chip technology, particularly in high-bandwidth memory that is essential for AI applications. Expanding Facilities and Capabilities: In 2024, SK Hynix is ramping up its semiconductor packaging capabilities to meet the growing demand for high-performance computing and AI applications. They are also planning to establish a new semiconductor packaging facility in West Lafayette, Indiana, with an investment of $3.87 billion, which will focus on advanced chip packaging technologies. Strategic Focus on High-Performance DRAM: For 2024, SK Hynix has highlighted plans to continue focusing on high-performance DRAM products such as HBM3E and HBM4, responding to the rising demand for AI memory. They are aiming to strengthen their technological leadership by developing high-capacity server and mobile modules.

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