HANJO KIM

Learn how MediaTek's scalable ASIC packaging serves diverse form factors with Jasbinder Bhoot, VP & GM, Enterprise ASIC Business Unit. As form factors in consumer and enterprise devices change in size, the need for scalable ASIC packaging becomes imperative for innovation. To suit the diverse range of device packaging requirements, MediaTek's ASIC architecture offerings have expanded, scaling packages to suit devices, big or small, without compromising efficiency or performance. Watch: https://bit.ly/4fch6p8 Discover more Exec Talks here: https://bit.ly/3SZe6Ux #MediaTek #ASIC #ExecTalk #EdgeProcessing #Gaming #AR #VR #5G

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🚀🌐 **MediaTek Joins Arm Total Design to Shape AI Computing's Future!**   🌟 At COMPUTEX 2024, MediaTek announced its collaboration with Arm Total Design to revolutionize AI computing. By leveraging Arm Neoverse™ Compute Subsystems (CSS), MediaTek aims to enhance AI performance and efficiency in data centers, telecom, and more.   💬 “Together, we’re enabling our customers to tackle the toughest AI workloads, maximizing performance per watt,” said Vince Hu, VP at MediaTek.   🌐 This partnership will drive AI innovation from edge to cloud, with MediaTek using its expertise to deliver top-notch, power-efficient solutions.   📈 “AI’s demand for more compute and efficiency is insatiable,” said Mohamed Awad, SVP at Arm. “Our collaboration with MediaTek will bring sustainable, AI-powered cloud data centers rapidly to market.”   🔥 MediaTek is also pushing the boundaries in mobile, Wi-Fi, and edge applications, ensuring top-tier performance and efficiency.   👉 #AIComputing #TechNews #Innovation #MediaTek #ArmTotalDesign #FutureTech #COMPUTEX2024

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MediaTek and AI at Meta are continuing their close collaboration to accelerate Meta Llama 3 8B on ExecuTorch using MediaTek’s 7th Generation AI processing units (APU). This work follows MediaTek’s efforts to bring APU acceleration to Llama 2 7B on ExecuTorch, which was recently completed. Released by PyTorch in Alpha today, ExecuTorch is an end-to-end solution for enabling on-device inference capabilities across mobile and edge devices. MediaTek is actively contributing to the ExecuTorch framework with delegate support, along with other industry peers, MediaTek continues to work to create a developer-friendly ecosystem through ExecuTorch integration with the MediaTek NeuroPilot SDK, which will accelerate Gen-AI application creation. MediaTek's APU hardware and NeuroPilot SDK offer superior flexibility to support more frameworks, such as ExecuTorch, which continue to promote the developer ecosystem with a better platform. https://bit.ly/3UpPEuD #MediaTek #Meta #AIatMeta #Llama3 #LLM #GenAI #APU #ExecuTorch

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Find out how MediaTek is accelerating 6G connectivity with AI in this Tek Talk with Jezabel Garcia, Senior Deep Learning Researcher. Improving connectivity, especially next-generation 6G, requires immense theoretical analysis and raw data processing compared to past generations. MediaTek sees AI as a valuable tool in this process, reducing the time and effort to analyze data and, therefore, accelerating time to market. Learn more about how MediaTek is working on channel selection and simulation in 6G. Watch: https://bit.ly/3QVxhNc Discover more Tek Talks here: https://bit.ly/48jKu8w #MediaTek #TelkTalk #Research #AIResearch #6G #AI

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MediaTek's Kompanio 838 Chipset for Enhanced AI Chromebooks https://lnkd.in/gCqCJGuW #MediaTeksKompanio838Chipset #838ChipsetforEnhancedAIChromebooks #Kompanio838Chipset #MediaTek #AIChromebooks #AINews #AnalyticsInsight #AnalyticsInsightMagazine

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Top-tier power optimization 📈 The MediaTek Dimensity 7300-Energy boosts CPU performance while slashing power consumption by 30% during day-to-day use. Discover the ultra-efficient #OPPOReno12Series 🔗 https://lnkd.in/gZmZA76h

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SK hynix: #GDDR7 Mass Production To Start in Q1'2025 Being a major JEDEC #memory standard, GDDR7 is slated to be produced by all three of the Big Three memory #manufacturers. But it seems that not all three vendors will be kicking off mass production at the same time. #SKhynix was at this year's #Computex trade show, showing off their full lineup of memory #technologies – including, of course, GDDR7. SK hynix is the last of the major memory vendor's we've seen promoting their memory, and fittingly, they seem to be the last in terms of their mass production schedule. According to company representatives at the show, the firm will not kick off mass production of their GDDR7 chips until the first quarter of 2025. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eEMBgD_N #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #ai #semiconductormanufacturing #dram #mobile #it

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Samsung Electronics maintains hybrid bonding needed for #HBM 16H 💡 Unlike SK hynix will continue MR-MUF in 16-stack HBM Samsung shared in a recent paper that it believes #hybridbonding was needed to manufacture a 16-stack high-bandwidth #memory (HBM). In its paper published during the 2024 IEEE 74th Electronic Components and Technology Conference held in Colorado last month titled, in Korean, D2W (die to wafer) Copper Bonding #Technology Research for HBM Stacking, the company said hybrid bonding for HBM with 16 stacks and above was a must. Hybrid bonding is a next-generation packaging technology where when #chips are stacked vertically through through-silicon-via (#TSV), or microscopic copper wire, there are no bumps between the stack. They are stacked directly. Hybrid bonding is also called direct bonding for this reason. Thanks again to Noh Tae Min and www.thelec.net for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e4CPS_tg #semiconductorindustry #semiconductors #semiconductor #foundry #ai #tech #chip #ic #artificialintelligence #southkorea #innovation #chips #it

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1200V 900A Hybrid module. With SiC SBD diode inside，the turn on switching loss is reduced to a very low level.

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AI Demand Surges: SK Hynix Accelerates HBM Technology Roadmap Deployment With the surge in artificial intelligence, HBM (High Bandwidth Memory) has shown strong momentum. Reportedly, SK Hynix is accelerating the deployment of its HBM development roadmap.  In the rapidly evolving global semiconductor industry, SK Hynix, with its keen market insight and excellent technological innovation capabilities, is accelerating the promotion of its HBM development roadmap. This strategic move not only demonstrates SK Hynix's precise grasp of future technological trends but also reflects the profound impact of the surge in AI demand on the semiconductor industry, especially in the field of high-performance computing. With the rapid development and widespread application of AI technology, from autonomous driving and intelligent healthcare to smart cities, various fields are calling for higher-performance computing capabilities. The complexity of AI models and the explosive growth of data volumes present unprecedented challenges for storage and processing speeds. In this context, HBM, as a high-performance, high-bandwidth memory solution, is gradually becoming a core component in key application areas such as AI servers and data centers. Facing the strong demand of the AI era, SK Hynix has decisively adjusted its strategic direction, making HBM one of its key development priorities. The company has not only increased its R&D investment in the HBM field but also plans to invest heavily in expanding its production capacity in the coming years. According to the latest news, SK Group plans to invest over $70 billion in its semiconductor business by 2028, with most of the funds allocated to the production of high-end memory chips such as HBM. #SK HYNIX #HBM

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🇺🇸【GUC will be at CDNLive in Santa Clara】 🇺🇸 ✨ Welcome to attend our speech session in CDNLive Silicon Valley. ✨ We are going to have a speech in CDNLive USA "3D-IC / Chiplets" session. 🚀 #Topic: Multi-Chip Integration Using Cadence Integrity 3D-IC Platform with TSMC 3Dblox 📆 Date: Apr. 17th (Wed.) 🕙 Time: 10a.m. 🏢 Santa Clara Convention Center / Room#209 (2F) 🎤 Speaker: YenChin Chiu Today, 3D chiplet-based designs are becoming more complicated, needing to consider all the heterogeneous components from chip, chiplet, and interposer required for CoWoS and SoIC assembly even before each individual die size and design information are known. Using the standardized 3Dblox language and data format, the complex die stacking structure and connectivity can be defined in a systematic approach. Leveraging Cadence Integrity 3D-IC Platform's native support of data conversion between Cadence iHDB and 3Dblox import/export, we can easily integrate all design data from each die and execute multi-die stacking verification. In this work, we will share GUC's experience on one Wafer-on-Wafer design done using the Integrity 3D-IC Platform for system-level floorplaning and bump planning while using iHDB and 3Dblox to maintain per-die design database, libraries, and technology files. This session will also show how 3Dblox works in multi-chip concurrent verification/analysis flows, such as 3D-stack DRC/LVS, cross-die RC extraction and STA, and 3D-IR analysis to avoid the error-prone die-to-die manual mapping. 🍀 #GUC #CDNLiveSiliconValley #Speech ************************************************************* GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services. Our comprehensive design services include: ⭐️ Spec-in and SoC integration ⭐️ Physical implementation ⭐️ Advanced packaging technologies ⭐️ Turn-key manufacturing ⭐️ HBM and die-to-die interconnect IPs Any further information, please refer to our website: www.guc-asic.com ************************************************************* 查看翻譯

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Does MediaTek Have an Identity Crisis?. Explore how MediaTek is not just adapting but thriving in the face of technological disruption through strategic collaborations, cutting-edge technology adoption, and a steadfast commitment to AI-driven solutions. Witness firsthand how MediaTek is carving a path towards tech excellence by embracing innovation, fostering partnerships, and leading the charge in shaping the future of semiconductor innovation. Read the full article here: https://buff.ly/3yiq6YV #CodelabsGlobal #MediaTekTechInnovation #AIIntegrationInitiatives #TechPartnershipSuccesses

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#SouthKorea's #Chip Stockpiles Shrink at Fastest Pace in 10 Years - Demand for #memory #chips increases in line with #AI development - #Samsung, #SKHynix vie to become main supplier to NVIDIA South Korea’s #semiconductor inventories dwindled by the most since 2014, underscoring the pace at which demand is outstripping supply as customers rev up their purchases of devices needed to develop #artificialintelligence #technologies. Chip stockpiles dropped 33.7% from a year earlier in April in the largest decrease since late 2014, according to data released Friday by the national statistical office. It also marked the fourth month of declines in inventories, which coincided with a pickup in South Korea’s semiconductor exports. Thanks again to Sam Kim and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eKF5c37V #semiconductormanufacturing #semiconductorindustry #technology #it #datacenter #artificialintelligence #computing #computer #cloud #tech

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Go GaN - From power to RF: GaN’s journey to a US$4.35B market by 2029 !

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Outpacing #Samsung or the End of Race? #Kioxia Aims 1000-layer #NAND by 2027 🤩🤯💡 After ending production cuts amidst a recovery in the #memory industry, KIOXIA Group disclosed its plans on the 3D NAND roadmap. According to reports from PC Watch and Blocks & Files, Kioxia stated that achieving a 1,000-layer level by 2027 would be possible. According to the reports, the number of 3D NAND layers has generally increased from 24 in 2014 to 238 in 2022, representing a tenfold rise over eight years. #Kioxia stated that achieving a 1,000-layer level by 2027 would be possible at a rate of increase of 1.33 times per year. The #Japanese #memory #chipmaker seems to be more ambitious than Samsung regarding the battle of layers. In May, Samsung revealed its target to release advanced NAND #chips with over 1000 layers by 2030. According to Wccftech, the #SouthKorean memory giant plans to apply new #ferroelectric materials on the manufacturing of NAND to achieve this goal. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eiVgEP66 #semiconductorindustry #semiconductormanufacturing #semiconductor #technology #tech #innovation #mobile #datacenter #chip #ic #icdesign

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#AI accelerators have been a hot area for some years, but the field is accelerating the move of server segment away from x86 architecture MediaTek Plans To Introduce Its Own AI Server Chips, Featuring ARM Architecture & TSMC 3nm Process https://lnkd.in/gJJw_z8n MediaTek getting on the Bandwagon now

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Exciting news! 🌟 Discover how MediaTek-powered Chromebooks are transforming education at The L. Hollingworth School for the Talented and Gifted. 💻💡 #MediaTek #미디어텍 #MediaTekKompanio #Chromebooks #CaseStudy

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