As chips and systems grow in complexity, power budgets are getting stretched. Just shifting left doesn’t solve all problems. By Adam Kovac. https://lnkd.in/g2R6EU_w #lowpower #glitchpower #datacenters #powerefficiency #poweroptimization #EDA Suhail Saif Ansys William Ruby Rob Knoth Cadence Design Systems Neil Hand Siemens EDA (Siemens Digital Industries Software) Synopsys Inc Steve Roddy Quadric Mark Seymour Newmark
Semiconductor Engineering
Online Audio and Video Media
Silicon Valley, CA 84,553 followers
Deep insights for the tech industry
About us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
- Website
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http://semiengineering.com
External link for Semiconductor Engineering
- Industry
- Online Audio and Video Media
- Company size
- 2-10 employees
- Headquarters
- Silicon Valley, CA
- Type
- Self-Owned
- Founded
- 2013
Locations
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Primary
Silicon Valley, CA, US
Employees at Semiconductor Engineering
Updates
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New Interconnect Metals Need New Dielectrics Options emerge for thin films that are viable at the most advanced nodes. By Katherine Derbyshire. https://lnkd.in/gt4Wyhjt #semiconductor #interconnects #ruthenium #gapfill #airgaps #dielectrics Bo Xie Applied Materials EMD Electronics Hanna Luusua PiBond TSMC Mikhail Krishtab KU Leuven Jacob Watson UC San Diego William Entley Jennifer Achtyl Robert Ridgeway Gilles Delie, PhD Gayle Murdoch Giulio Marti Ivo Stassen imec Dr. Dipayan Pal Naeun Yang Harsono Simka Andrew Kummel
New Interconnect Metals Need New Dielectrics
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Special Report: Key Technologies To Extend EUV To 14 Angstroms: https://lnkd.in/eh4DNDE5 Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions. By Laura Peters. https://lnkd.in/eh4DNDE5 #HighNAEUV #semiconductor #lithography #EUVlithography imec ASML IBM TSMC Michael Lercel Richard Wise Lam Research Luciana Meli IBM Research JSR Corporation Tomonari Yamamoto TOKYO ELECTRON LIMITED Brewer Science Aki Fujimura D2S, Inc.
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Floor-Planning Evolves Into The Chiplet Era: https://lnkd.in/g97PWxCS Automatically mitigating thermal issues becomes a top priority in heterogeneous designs. By Karen Heyman. https://lnkd.in/g97PWxCS #chiplets #thermalmanagement #floorplanning #EDA #semiconductor Tony Chan Carusone Alphawave Semi Vinay Patwardhan Cadence Design Systems Kenneth Larsen Synopsys Inc #3DIC Kai-Yuan (Kevin) Chao Siemens EDA (Siemens Digital Industries Software) Andy Nightingale Arteris Massachusetts Institute of Technology Ryotaro Okabe ABHIJATMEDHI CHOTRATTANAPITUK
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New technical papers recently added to Semiconductor Engineering’s library. https://lnkd.in/g8BnUzEc #semiconductor #SiC #semiconductortest #hardwaresecurity #TMDs #6G #verification #NVM #neuralnetworks University of Cambridge Wei Mu Ameer Janabi Borong Hu University of Illinois Urbana-Champaign Lynford Goddard Paul Braun #photonics Purdue University Technische Universität Dresden Ruhr University Bochum Armin Darjani, Nima Kavand Harvard University, Google Research, Stanford University, University of California, Riverside Eric Peterson Trond Ikdahl Andersen University of Oulu Hänninen, Oskari Tervo, Antti Tölli, Matti Latva-aho Intel Labs Indian Institute of Science (IISc) Rajat Jain Sreenivas Subramoney Arkaprava Basu Marco Fattori Yoeri van de Burgt
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Chip Industry Week In Review: https://lnkd.in/gVfxKUqN Amkor packaging funding; SK hynix $6.8B fab complex; rare-earths deal; top technology megatrends; DDR5 standard; chiplet packaging deal; SDV partnership; legacy process nodes; UK-India deal; DRAM, NAND flash revenue https://lnkd.in/gVfxKUqN #semiconductor #semiconductormanufacturing #DDR5 Amkor Technology, Inc. SK hynix Trident Global Zoetic Global IBM ASMPT Ltd Arm Micron Technology National Institute of Standards and Technology (NIST) EFC Gases & Advanced Materials Valtrix Systems European Chips Diversity Alliance Nanotronics University of California, Santa Cruz Mike Peña NI (National Instruments) Infineon Technologies Keysight Technologies
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It’s been decades since there was a disruption within EDA, but AI could change the semiconductor development flow and force change within EDA. By Brian Bailey https://lnkd.in/gFPXB3Z7 #EDA #chipdesign #AI #GenAI Prith Banerjee Ansys Altair James Scapa Jan Rabaey University of California, Berkeley imec Charles Alpert Cadence Design Systems Stelios Diamantidis Synopsys Inc Erik Berg Microsoft Vidya Chhabria Arizona State University
Will AI Disrupt EDA?
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The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. By Gregory Haley. https://lnkd.in/dPtTvFUU #semiconductor #lithography #patterning #advancedpackaging Calvin Cheung ASE Global Amkor Technology, Inc. Myungwoon (brian) Hwang William Ruby Synopsys Inc Doug Shelton Canon USA Dick Otte Promex Industries Inc. Harry Levinson DIGITHO Richard Beaudry David Lam Multibeam Corporation
Precision Patterning Options Emerge For Advanced Packaging
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Legacy Process Nodes Going Strong: https://lnkd.in/gqsK37Qr The critical, and growing, significance of mature node chips and processes. By Bryon Moyer. #semiconductor #semiconductormanufacturing #200mm #300mm #lithography #devicescaling Andy Appleby CEng David Park Krishna Balachandran Kevin Lucas Al Blais Microchip Technology Inc. Intel Corporation Synopsys Inc United Microelectronics Corporation (UMC) Tignis NVIDIA Samsung Semiconductor
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Data Center Thermal Management Improves: https://lnkd.in/dDV-enaR Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. By Karen Heyman. #semiconductor #datacenter #heat #CFD #multiphysics #digitaltwins Steven Woo Rambus NVIDIA Mark Fenton Cadence Design Systems Antonio Caruso Siemens Digital Industries Software Ansys Marc Swinnen John Ferguson Manish Mehta Broadcom Synopsys Inc Shankar Krishnamoorthy
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